Posted By: Sam Bashir
August 2014: A step forward in biomedical engineering, doctors at Ohio State University have implanted a neurostimulator containing a Sigenics-designed chip. The neurostimulator is intended to treat the intense pain associated with…
August 2014:
A step forward in biomedical engineering, doctors at Ohio State University have implanted a neurostimulator containing a Sigenics-designed chip. The neurostimulator is intended to treat the intense pain associated with cluster headaches. It is designed to be implanted behind the cheekbone of the patient, and comes with a handheld device that allows the patient to activate the implant when a headache occurs.
The chip designed by Sigenics handles command and control functions of the implant, power conversion and neural stimulation, stimulating the sphenopalatine ganglion nerve bundle behind the nose to relieve cluster headache pain.
Find out more about the implant by reading this Medical Design Technology Article and watching the video below.